Thermal Conductive Gel

The two-component thermal conductive gel sealing material with a thermal conductivity ranging from 2.0 to 8.0 W/m*K is suitable for applications with low assembly stress and can be applied using automated dispensing systems. The material is mixed thoroughly through a helical mixing tube and can cure at room temperature or at high temperatures. The surface tension of the gel is extremely low (almost negligible), allowing it to conform well to the interface of the materials and resulting in low thermal resistance. Once cured, its performance is equivalent to that of thermal conductive pads, providing excellent thermal conductivity, insulation, and shock absorption. Additionally, the thermal conductive gel is made of an organic silicon formulation that is non-toxic, odorless, non-corrosive, and compliant with RoHS directives and environmental requirements.

1. Features

• Good insulation and high/low temperature resistance.
• Flame retardant rating of UL94 V0
• Good workability and flexibility

2. Characterizations

Disclaimer: ACS Material, LLC believes that the information in this Technical Data Sheet is accurate and represents the best and most current information available to us. ACS Material makes no representations or warranties either express or implied, regarding the suitability of the material for any purpose or the accuracy of the information contained within this document. Accordingly, ACS Material will not be responsible for damages resulting from use of or reliance upon this information.